Plasma-Etcher
Equipment: Polaron PT7100 RF Plasma Barrel Etcher
Analytical characteristics:
Etching gas: O2/CF4
Specimen geometry: until Ø ca. 10 cm
FG Disperse Feststoffe
Different silicon-containing ceramic and metallic phases as well as grain boundaries on the surfaces of bulk materials can be chemically activated by plasma etching and for example be contrasted for optical examinations.
Equipment: Polaron PT7100 RF Plasma Barrel Etcher
Analytical characteristics:
Etching gas: O2/CF4
Specimen geometry: until Ø ca. 10 cm