Plasma Etching

Different silicon-containing ceramic and metallic phases as well as grain boundaries on the surfaces of bulk materials can be chemically activated by plasma etching and for example be contrasted for optical examinations.

Plasma-Etcher

Polaron PT7100 RF Plasma Barrel Etcher

Equipment: Polaron PT7100 RF Plasma Barrel Etcher

Analytical characteristics:

Etching gas: O2/CF4

Specimen geometry: until Ø ca. 10 cm