Welcome to Kun Hu

New Team Member in TMM

2021/10/05 by M. Walker

We welcome Kun Hu who has joined us on 4 October from the School of Material Science and Engineering of the Central South University in China. As an exchange Ph.D. student Kun Hu will be researching “high-throughput design of Co-based Heusler allows a multifunctional magnetic materials via substitutional doping”. He has been awarded a scholarship from the China Scholarship Council for two years.